asm3p18s19b notebook lcd panel emi reduction ic ?20 10 scillc. all rights reserved. publication order n umber: january 2010 C rev. 3 asm3p18s19 /d features fcc approved method of emi attenuation. provides up to 15db emi reduction. generates a low emi spread spectrum clock and a non - spread reference clock of the input frequency. optimized for frequency range from 20 to 40mhz. internal loop filter min imizes external components and board space. low inherent cycle - to - cycle jitter. two spread % selections: - 1.25% to - 1.75%. 3.3v operating voltage. low power cmos design. supports notebook vga and other lcd timing controller applications. power down functio n for mobile application. available in commercial temperature range. available in 8 - pin soic and tssop packages. rohs compliant product description the asm3p18s19b is a versatile spread spectrum frequency modulator designed specifically for input clock fre quencies from 20 to 40mhz. (refer to input frequency and modulation rate table ). the asm3p18s19b reduces electromagnetic interference (emi) at the clock source, allowing system wide reduction of emi of down stream clock and data dependent signals. the asm3 p18s19b allows significant system cost savings by reducing the number of circuit board layers, ferrite beads, shielding, and other passive components that are traditionally required to pass emi regulations. the asm3p18s19b modulates the output of a single pll in order to spread the bandwidth of a synthesized clock, and more importantly, decreases the peak amplitudes of its harmonics. this results in significantly lower system emi compared to the typical narrow band signal produced by oscillators and most frequency generators. lowering emi by increasing a signal?s bandwidth is called ?spread spectrum clock generation?. the asm3p18s19b uses the most efficient and optimized modulation profile approved by the fcc and is implemented in a proprietary all digita l method. applications the asm3p18s19b is targeted towards emi management for memory and lvds interfaces in mobile graphic chipsets and high - speed digital applications such as pc peripheral devices, consumer electronics, and embedded controller systems. block diagram vss vdd modout xin/clkin frequency divider feedback divider modulation phase detector loop filter vco output divider pll srs pd# crystal oscillator xout ref
asm3p18s19b rev. 3 | page 2 of 7 | www.onsemi.com vdd pd# xout ref 1 2 3 4 5 6 7 8 asm3p18s19b xin/ clkin vss srs modout pin configuration pin description pin# pin name type description 1 xin / clkin i crystal connection or external frequency inp ut.this pin has dual functions. it can be connected to either an external crystal or an external reference clock . 2 vss p ground connection. connect to system ground. 3 srs i spread range select. digital logic input used to select frequency deviation ( re fer to spread deviation selection table). this pin has an internal pull - up resistor. 4 modout o spread spectrum clock output. ( refer to input frequency and modulation rate table and spread deviation selection table) 5 ref o non - modulated reference clock output of the input frequency. 6 pd# i power down control pin. pull low to enable power - down mode. this pin has an internal pull - up resistor. 7 vdd p power supply for the entire chip. 8 xout o crystal connection. input connection for an external crystal . if using an external reference, this pin must be left unconnected. input frequency and modulation rate part number input frequency range output frequency range modulation rate asm3p18s19b 20mhz to 40mhz 20mhz to 40mhz input frequency / 512 spread deviation selection part number srs spread deviation asm3 p18 s 19b 0 - 1.25% (down) 1 - 1.75% (down)
asm3p18s19b rev. 3 | page 3 of 7 | www.onsemi.com absolute maximum ratings symbol parameter rating unit vdd, v in voltage on any pin with respect to ground - 0.5 to +4.6 v t stg storage temperature - 65 to +125 c t a operating temperature 0 to +70 c t s max. soldering temperature (10 sec) 260 c t j junction temperature 150 c t dv static discharge voltage (as per jedec std22 - a114 - b) 2 kv note: these are stress ratings only and are not implied for func tional use. exposure to absolute maximum ratings for prolonged periods of time may affect device reliability. dc electrical characteristics (test condition: all parameters are measured at room temperature (+25c) unless otherwise stated . ) symb ol parameter min typ max unit v il input low voltage vss - 0.3 - 0.8 v v ih input high voltage 2.0 - v dd + 0.3 v i il input low current (inputs pd#, srs) - 60.0 - - 20.0 a i ih input high current - - 1.0 a i xol x out output low current @ 0.4v, v dd = 3.3v - 3 - ma i xoh x out output high current @ 2.5v, v dd = 3.3v - 3 - ma v ol output low voltage v dd = 3.3v, i ol = 20ma - - 0.4 v v oh output high voltage v dd = 3.3v, i oh = 20ma 2.5 - - v i cc dynamic supply current normal mode 3.3v and 25pf probe loading 7.1 f in - min - 26.9 f in - max ma i dd static supply current standby mode - 4.5 - ma v dd operating voltage - 3.3 - v t on power up time (first locked clock cycle after power up) - 0.18 - ms z out clock output impedance - 50 - ? ac electrical characteristics symbol parameter min typ max unit f in input frequency 20 - 40 mhz f out output frequency 20 - 40 mhz t lh * output rise time measured from 0.8v to 2.0v - 0.66 - ns t hl * output fall time measured from 0.8v to 2.0v - 0.65 - ns t jc jitter (c ycle to cycle ) - 200 - 200 ps t d output duty cycle 45 50 55 % *t lh and t hl are measured into a capacitive load of 15pf
asm3p18s19b rev. 3 | page 4 of 7 | www.onsemi.com package information 8 - lead (150 - mil) soic package symbol dimensions inches millimeters min max min max a1 0.004 0.010 0.10 0.25 a 0.053 0.069 1.35 1.75 a2 0.049 0.059 1.25 1.50 b 0.012 0.020 0.31 0.51 c 0.007 0.01 0 0.18 0.25 d 0. 193 bsc 4. 90 bsc e 0. 154 bsc 3. 91 bsc e 0.050 bsc 1.27 bsc h 0. 236 bsc 6.00 bsc l 0.016 0.050 0.41 1.27 0 8 0 8 package length (excluding end fla sh) d - 188 ~ 193 mils. package length (including end flash) d1 - 198 ~ 207 mils .
asm3p18s19b rev. 3 | page 5 of 7 | www.onsemi.com 8 - lead tssop (4.40 - mm body) symbol dimensions i nches m illimeters min max min max a 0.043 1.10 a1 0.002 0.006 0.05 0.15 a2 0.033 0.037 0.85 0 .95 b 0.008 0.012 0.19 0.30 c 0.004 0.008 0.09 0.20 d 0.114 0.122 2.90 3.10 e 0.169 0.177 4.30 4.50 e 0.026 bsc 0.65 bsc h 0. 252 bsc 6. 40 bsc l 0.020 0.028 0.50 0.70 0 8 0 8 note: controlling dimensions are millimeters tssop C 0.0325 grams unit weight e h a a1 a2 d b c l e
asm3p18s19b rev. 3 | page 6 of 7 | www.onsemi.com ordering information part number marking pa ckage type temperature asm3p 18s19b f - 08tt 3p 18s19bf 8 - pin tssop, tube , pb free commercial asm3p 18s19b f - 08tr 3p 18s19bf 8 - pin tssop, tape & reel , pb free commercial p 3p 18s19b f - 08st 3p 18s19bf 8 - pin soic, tube , pb free commercial p 3p 18s19b f - 08sr 3p 18s19bf 8 - pin soic, tape & pb free commercial asm3p 18s19bg - 08tt 3p 18s19bg 8 - pin tssop, tube , green commercial asm3p 18s19bg - 08tr 3p 18s19bg 8 - pin tssop, tape & reel , green commercial asm3p 18s19bg - 08st 3p 18s19bg 8 - pin soic, tube , green commercial asm3p 18s19bg - 08 sr 3p 18s19bg 8 - pin soic, tape & reel , green commercial products are available for industrial temperature range operation. please contact factory for more information. device ordering information a s m 3 p 1 8 s 1 9 b f - 0 8 t r licensed un der us patent #5,488,627, #6,646,463 and #5,631,920. o = sot u = msop s = soic e = tqfp t = tssop l = lqfp a = ssop u = msop v = t vsop p = pdip b = bga d = qsop q = qfn x = sc - 70 device pin count x= automotive i= industrial p or n/c = commercial ( - 40c to +125c) ( - 40c to +85c) (0c to +70c) 1 = reserved 6 = power management 2 = non pll based 7 = power management 3 = emi reduction 8 = power management 4 = ddr support products 9 = hi performance 5 = std zero delay buffer 0 = reserved on semiconductor mixed signal product part number f = lead free and rohs compliant part g = green package, lead free, and rohs r = tape & reel, t = tube or tray
asm3p18s19b note: this product utilizes us patent # 6,646,463 impedance emulator patent issued to pulsecore semiconductor, dated 11 - 11 - 2003 on semiconductor and are registered trademarks of semiconductor components industr ies, llc (scillc). scillc reserves the right to make changes without further notice to any products herein. scillc makes no warranty, representation or guarantee regarding the suitabili ty of its products for any particular purpose, nor does scillc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liabili ty, including without limitation special, consequential or incidental damages. typical parameters which may be provided in scil including typicals must be publication ordering information lite rature fulfillment: literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone: 303 - 675 - 2175 or 800 - 344 - 3860 toll free usa/canada fax: 303 - 675 - 2176 or 800 - 344 - 3867 toll free usa/canada email: orderlit@onsemi.com n. american technical support : 800 - 282 - 9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81 - 3 - 5773 - 3850 on semiconductor website: www.onsemi.com order literature: http://www .onsemi.com/orderlit for additional informa tion, please contact your local sales representative
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